Microchip Technology Launches Conversion to its Product Packaging

Microchip Technology Inc. (www.microchip.com), a provider of microcontroller and analog semiconductors, today announced the conversion of its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005, in compliance with pending worldwide government regulations and industry standards.

"We are very pleased to assist our customers in achieving early compliance with the European Union RoHS directive and other countries' similar regulations," said Steve Sanghi, Microchip's President and CEO.

The Company has selected matte tin (Sn) as its new plating material. This ensures that Microchip Pb-free products are backward compatible with industry-standard, tin/lead-based soldering processes, and forward compatible with higher-temperature Pb-free processes that are used with Pb-free pastes such as tin/silver/copper (SnAgCu).

The European Union "Restrictions on Hazardous Substances" (RoHS) directive is scheduled to go into effect on July 1, 2006, and governs all electronic equipment manufactured or sold in the European Union member countries.

Microchip is able to retain Moisture Sensitivity Level 1 (MSL1) at 260 degrees Celsius, which is the higher soldering temperature required by some Pb-free soldering systems -- ensuring forward compatibility.